41034 IoT Components and Fabrication6cp; on campus. Forms of attendance and mode of delivery in this subject have changed to enable social distancing and reduce the risks of spreading COVID-19 in our community.
Requisite(s): 48510 Introduction to Electrical and Electronic Engineering AND 33130 Mathematical Modelling 1 AND 68037 Physical Modelling AND 41033 Integrated Electronic Systems Design
Fields of practice: Electronic Engineering program
This subject is a third-year core subject in electronics, and covers the hardware technologies in the IoT nodes at the component level, with particular focus on the possibilities offered by miniaturisation and nanotechnology.
Being able to open the 'component boxes' and become familiarise with the current miniaturised technologies, their capabilities and limitations, is a crucial requirement for a meaningful design of an IoT system and for anticipating the next technological advances to unlock radical innovation.
Students learn the basic principles of sensing, accuracy and sensitivity, and how those principles are applied, i.e. to chemical or physical sensing through electronic, MEMS and photonic technologies. The students learn while examining actual IoT systems how from the simplest form of Radio Frequency Identification tags, the IoT nodes can be made extremely sophisticated ('smart') and fully autonomous when equipped with adequate components. In parallel, the subject teaches how the components can be modelled and then fabricated through semiconductor fabrication and/or 3D printing, with a critical outlook on performance, reliability and cost.
Spring session, City campus
Detailed subject description.